The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical en
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating,
Very Large Scale Integration (VLSI) technology has raised significant considerations of thermal control. This practical reference for thermal and design enginee
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating,
The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In