Amvik eBook Solutions

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For

This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essen

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still ba

This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and micro