Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different funct
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and e
Numerous efforts are directed at investigating the use of optics at short distances--for example, at the chip-to-chip and board-to-board levels of the interconn
This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author’s extensive, industrial experie
To provide ubiquitous and various services, 6G networks tend to be more comprehensive and multidimensional by integrating current terrestrial networks with spac