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Modeling and Design of Electromagnetic Compatibility for High-speed Printed Circuit Boards and Packaging
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7.2.2.1 Modeling of the Graphene Absorber -- 7.2.2.2 Fabrication and Measurement -- 7.2.2.3 Conclusion -- References -- Index
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of th
EMC and the Printed Circuit Board
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This accessible, new reference work shows how and why RF energy iscreated within a printed circuit board and the manner in whichpropagation occurs. With lucid e
Power Distribution Networks with On-Chip Decoupling Capacitors
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Signal Integrity and Radiated Emission of High-Speed Digital Systems
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Before putting digital systems for information technology or telecommunication applications on the market, an essential requirement is to perform tests in order