Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
Author :
Publisher : Springer Science & Business Media
Total Pages : 195
Release :
ISBN-10 : 9781475731590
ISBN-13 : 1475731590
Rating : 4/5 (90 Downloads)

Book Synopsis Benefiting from Thermal and Mechanical Simulation in Micro-Electronics by : G.Q. Zhang

Download or read book Benefiting from Thermal and Mechanical Simulation in Micro-Electronics written by G.Q. Zhang and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 195 pages. Available in PDF, EPUB and Kindle. Book excerpt: Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- LIST type="5" The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.


Benefiting from Thermal and Mechanical Simulation in Micro-Electronics Related Books

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
Language: en
Pages: 195
Authors: G.Q. Zhang
Categories: Technology & Engineering
Type: BOOK - Published: 2013-06-29 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For
Benefiting from thermal and mechanical simulation in (micro)-electronics
Language: fr
Pages:
Authors: GQ Zhang
Categories:
Type: BOOK - Published: 2001-04-01 - Publisher:

DOWNLOAD EBOOK

Mechanics of Microelectronics
Language: en
Pages: 580
Authors: G.Q. Zhang
Categories: Technology & Engineering
Type: BOOK - Published: 2006-08-25 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essen
Modeling and Simulation for Microelectronic Packaging Assembly
Language: en
Pages: 586
Authors: Shen Liu
Categories: Technology & Engineering
Type: BOOK - Published: 2011-05-17 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still ba
Reliability of Organic Compounds in Microelectronics and Optoelectronics
Language: en
Pages: 552
Authors: Willem Dirk van Driel
Categories: Technology & Engineering
Type: BOOK - Published: 2022-01-31 - Publisher: Springer Nature

DOWNLOAD EBOOK

This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and micro