Materials study for interfacial adhesion and reliability of microelectronics packaging structures
| Author | : Xiang Dai |
| Publisher | : |
| Total Pages | : 328 |
| Release | : 1998 |
| ISBN-10 | : OCLC:44477351 |
| ISBN-13 | : |
| Rating | : 4/5 (51 Downloads) |
Book Synopsis Materials study for interfacial adhesion and reliability of microelectronics packaging structures by : Xiang Dai
Download or read book Materials study for interfacial adhesion and reliability of microelectronics packaging structures written by Xiang Dai and published by . This book was released on 1998 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt:
