Modeling, Design, and Fabrication of Carbon Nanostructures for Next-generation Integrated Circuit Interconnects and Passive Devices
Author | : Hong Li |
Publisher | : |
Total Pages | : 230 |
Release | : 2012 |
ISBN-10 | : 1267767685 |
ISBN-13 | : 9781267767684 |
Rating | : 4/5 (85 Downloads) |
Book Synopsis Modeling, Design, and Fabrication of Carbon Nanostructures for Next-generation Integrated Circuit Interconnects and Passive Devices by : Hong Li
Download or read book Modeling, Design, and Fabrication of Carbon Nanostructures for Next-generation Integrated Circuit Interconnects and Passive Devices written by Hong Li and published by . This book was released on 2012 with total page 230 pages. Available in PDF, EPUB and Kindle. Book excerpt: The semiconductor industry is confronting an acute problem in the interconnect area--as IC feature sizes continue to be scaled below 22 nm, Cu wires exhibit significant "size effects" resulting in a sharp rise in their resistivity, which in turn has adverse impact both on IC performance and reliability.